![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Surface Planarization of Polymeric Interlayer Dielectrics for FOWLP Applications
Kang, Soojung, Kim, Yejin, Moon, Ayoung, Lee, Sangwon, Kim, Sarah Eunkyung, Kim, SungdongYear:
2018
Language:
english
DOI:
10.1109/eptc.2018.8654287
File:
PDF, 295 KB
english, 2018