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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Studies on Contact Degradation Process and Failure Mechanism of GIB Plug-in Connector

Guan, Xiangyu, Qin, Jinshu, Shu, Naiqiu, Peng, Hui
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2019.2930415
File:
PDF, 1.29 MB
english, 2019
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