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[IEEE 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Montreal, QC, Canada (2019.5.26-2019.5.26)] 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Investigating on the Impact of Software Clones on Technical Debt
Lerina, Aversano, Nardi, LauraYear:
2019
Language:
english
DOI:
10.1109/techdebt.2019.00029
File:
PDF, 284 KB
english, 2019