Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies
Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Lehto, Tero, Wu, Liang, Wilcox, Geoffrey D., Wang, Jing, Collander, Paul, Hokka, JussiLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07534-7
Date:
August, 2019
File:
PDF, 2.87 MB
english, 2019