Laser beam induced thermal-crack propagation for asymmetric...

Optics & Laser Technology 2019 / 12 Vol. 120

Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer

Cheng, Xiaoliang, Yang, Lijun, Wang, Maolu, Cai, Yecheng, Wang, Yang, Ren, Zhixing
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Volume:
120
Language:
english
Journal:
Optics & Laser Technology
DOI:
10.1016/j.optlastec.2019.105765
Date:
December, 2019
File:
PDF, 6.37 MB
english, 2019
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