[IEEE 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Chandigarh, India (2018.12.16-2018.12.18)] 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Simulation-Based Impedance Characterization of PDN in High-Performance Multi-Chip HTCC Packages for Avionics

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.