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[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling
Yuan, Cadmus, Hong, Yu-Jun, Lee, Chang-Chi, Chiang, Kou-Ning, Huang, Jin-HuangYear:
2019
Language:
english
DOI:
10.1109/EuroSimE.2019.8724570
File:
PDF, 284 KB
english, 2019