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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Microstructures of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Processes
Kim, Youngja, Hah, Jinho, Fernandez-Zelaia, Patxi, Lee, Sangil, Christie, Leroy, Houston, Paul, Melkote, Shreyes, Moon, Kyoung-Sik, Wong, Ching-PingYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00324
File:
PDF, 804 KB
english, 2019