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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
Wietstruck, Matthias, Schulze, Sebastian, Rebhan, Bernhard, Kerepesi, Peter, Kurz, Helmut, Silberer, Gerald, Meiler, Josef, Tolunay Wipf, Selin, Wipf, Christian, Kaynak, MehmetYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00147
File:
PDF, 922 KB
english, 2019