[IEEE 2019 IEEE 69th Electronic Components and Technology...

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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Next Generation of 2-7 Micron Ultra-Small Microvias for 2.5D Panel Redistribution Layer by Using Laser and Photolithography Technologies

Liu, Fuhan, Nair, Chandrasekharan, Khurana, Gaurav, Watanabe, Atom, DeProspo, Bartlet H., Kubo, Atsushi, Lin, Cheng Ping, Makita, Toshiyuki, Watanabe, Naoki, Tummala, Rao R.
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Year:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00144
File:
PDF, 802 KB
english, 2019
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