[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Study of the Board Level Reliability Performance of a Large 0.3 mm Pitch Wafer Level Package
Waidhas, Bernd, Proschwitz, Jan, Pietryga, Christoph, Wagner, Thomas, Keser, BethYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00179
File:
PDF, 633 KB
english, 2019