[IEEE 2019 18th IEEE Intersociety Conference on Thermal and...

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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor

Ghaffari, Omidreza, Grenier, Francis, Morissette, Jean-Francois, Bolduc, Martin, Jasmin, Simon, Sylvestre, Julien
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Year:
2019
DOI:
10.1109/ITHERM.2019.8757380
File:
PDF, 1.27 MB
2019
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