[IEEE 2019 Symposium on Design, Test, Integration &...

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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Improved process for the manufacturing of back contact integrated cooling channels for concentrator solar cells

Rozsas, Gabor, Bognar, Gyorgy, Takacs, Gabor, Plesz, Balazs
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Year:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752813
File:
PDF, 564 KB
english, 2019
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