[IEEE 2019 IEEE 69th Electronic Components and Technology...

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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment

Jangam, SivaChandra, Bajwa, Adeel Ahmed, Mogera, Umesh, Ambhore, Pranav, Colosimo, Tom, Chylak, Bob, Iyer, Subramanian
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Year:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00099
File:
PDF, 1.88 MB
english, 2019
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