[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process
Kuo, C.H., Yang, S.B., Kuo, C.C., Chen, Y.N., Yuan, K.S., Huang, G.C., Ke, C.N., Chang, Grace, Hsu, C.C., Huang, H.L., Wang, Kirin, Ku, Harry, Chen, C.S., Liu, K.C., Kalnitsky, Alex, Liao, MarvinYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00245
File:
PDF, 302 KB
english, 2019