A 50-kW Air-Cooled SiC Inverter with 3D-Printing Enabled...

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IEEE Transactions on Industry Applications 2019

A 50-kW Air-Cooled SiC Inverter with 3D-Printing Enabled Power Module Packaging Structure and Genetic Algorithm Optimized Heatsinks

Wang, Zhiqiang Jack, Chinthavali, Madhu, Campbell, Steven, Wu, Tong, Ozpineci, Burak
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Industry Applications
DOI:
10.1109/TIA.2019.2938471
File:
PDF, 1.69 MB
english, 2019
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