![](/img/cover-not-exists.png)
Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points
Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O.Volume:
9
Language:
english
Journal:
Scientific Reports
DOI:
10.1038/s41598-019-47690-8
Date:
December, 2019
File:
PDF, 2.12 MB
english, 2019