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[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - High bonding yield and brighter integrated GaN LED and Si-CMOS
Lee, Kwang Hong, Zhang, Li, Wang, Yue, Lee, Kenneth, Chua, Soo Jin, Fitzgerald, Eugene, Tan, Chuan SengYear:
2019
Language:
english
DOI:
10.23919/ltb-3d.2019.8735310
File:
PDF, 622 KB
english, 2019