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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Diffusion Enhanced Drive Sub 100 °C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration
Panigrahy, Asisa Kumar, Bonam, Satish, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00-24
File:
PDF, 939 KB
english, 2019