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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Modelling of Electromagnetic Coupling in Micro-scale Electromagnetic Energy Harvester
Sokolov, Andrii, Mallick, Dhiman, Roy, Saibal, Kennedy, Michael Peter, Blokhina, ElenaYear:
2019
Language:
english
DOI:
10.1109/DTIP.2019.8752738
File:
PDF, 453 KB
english, 2019