[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - A Zero Height Small Size Low Cost RF Interconnect Substrate Technology For RF Front Ends For M.2 Modules And SiP
Dalmia, Sidharth, Nahalingam, Kirthika, Vijayakumar, Swathi, Talebbeydokhti, PouyaYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00256
File:
PDF, 639 KB
english, 2019