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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and its Predictive Methodology
Duca, Roseanne, Luan, Jing En, Villa, Claudio Maria, Rovitto, Marco, Passagrilli, Carlo, Morelli, Arianna, Hla, Phone MawYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654402
File:
PDF, 260 KB
english, 2018