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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
Yu, Zechun, Wang, Shize, Letz, Sebastian, Bayer, Christoph Friedrich, Hausler, Felix, Schletz, Andreas, Suganuma, KatsuakiYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733496
File:
PDF, 3.34 MB
english, 2019