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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Transient Response of Miniaturized Piezoresistive Sensors for Side-On Pressure Shock Wave in Air
Julien, VEYRUNES, Jerome, RIONDET, Andre, FERRAND, Maylis, LAVAYSSIERE, Alexandre, LEFRANCOIS, Jerome, LUC, Herve, AUBERT, Patrick, PONSYear:
2019
Language:
english
DOI:
10.1109/DTIP.2019.8752911
File:
PDF, 872 KB
english, 2019