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Assembly of multiple ultra-thin chips on flexible foils with high placement accuracy by a simple transfer process
Janek, Florian, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, AndreYear:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2938189
File:
PDF, 1001 KB
english, 2019