[IEEE 2019 Symposium on Design, Test, Integration &...

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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Characterization method for integrated planar devices at low frequencies (up to 100 MHz)

Oumar, D. A., Boukhari, M. I., Taha, M. A., Capraro, S., Pietroy, D., Chatelon, J. P., Rousseau, J. J.
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Year:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752727
File:
PDF, 1.02 MB
english, 2019
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