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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Warpage Variation Analysis and Model Prediction for Molded Packages
Niu, Yuling, Wang, Wei, Wang, Zhijie, Dhandapani, Karthik, Schwarz, Mark, Syed, AhmerYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00129
File:
PDF, 613 KB
english, 2019