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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Multilayer RDL Interposer for Heterogeneous Device and Module Integration
Lin, Yi-Hang, Yew, M.C., Chen, S.M., Liu, M.S., Kavle, Pravin, Lai, T.M., Yu, C.T., Hsu, F.C., Chen, C.S., Fang, T.J., Hsu, C.K., Lee, K.C., Lin, C.H., Lin, P.Y., Jeng, Shin-PuuYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00145
File:
PDF, 650 KB
english, 2019