[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Low-Cost Non-TSV Based 3D Packaging Using Glass Panel Embedding (GPE) for Power-Efficient, High-Bandwidth Heterogeneous Integration
Ravichandran, Siddharth, Yamada, Shuhei, Liu, Fuhan, Smet, Vanessa, Kathaperumal, Mohanalingam, Tummala, RaoYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00277
File:
PDF, 1.29 MB
english, 2019