![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations
Hensel, Alexander, Schwarzer, Christian, Scheetz, Matthias, Kaloudis, Michael, Franke, JoergYear:
2018
Language:
english
DOI:
10.1109/eptc.2018.8654421
File:
PDF, 338 KB
english, 2018