AIP Conference Proceedings [AIP The fifth international workshop on stress induced phenomena in metallization - Stuttgart (Germany) (23-25 June 1999)] - Quantitative texture analysis of Cu damascene interconnects
Huot, A., Fishcer, A. H., von Glasow, A., Schwarzer, R. A.Year:
1999
Language:
english
DOI:
10.1063/1.59914
File:
PDF, 672 KB
english, 1999