[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Package-on-Package Micro-BGA Microstructure Interaction with Bond and Assembly Parameter
Gagnon, Pascale, Fortin, Clement, Weiss, ThomasYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00053
File:
PDF, 1.05 MB
english, 2019