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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of defected behavior on interfacial heat transferring performance for HP-LED packaging based on entropy generation analysis
Cui, Peng, Cai, Miao, Yang, DaoguoYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480565
File:
PDF, 8.18 MB
english, 2018