[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Solid-Liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
Aasmundtveit, Knut E, Luu, Thi-Thuy, Nguyen, Hoang-Vu, Larsson, Andreas, Tollefsen, Torleif AYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00029
File:
PDF, 659 KB
english, 2019