![](/img/cover-not-exists.png)
[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Performance Evaluation of Liquid 3D Chip Cooling Systems Under Non-Uniform Power Density: Effects of Inlet and Plenum Configurations
Soleimanikutanaei, Soheil, Lin, Cheng-Xian, Pala, Nezih, Quan, GangYear:
2019
DOI:
10.1109/itherm.2019.8757340
File:
PDF, 1.46 MB
2019