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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Bonding strength of Cu-to-Cu joints using Cu cold spray deposition by an oxidation and reduction process for power device package
Hou, Juncai, Li, Chengxin, Huang, Sijie, Nishikawa, HiroshiYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733503
File:
PDF, 2.52 MB
english, 2019