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[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Tactile Sensing From Backside of Flexible Printed Circuit Using LSI-Integrated Sensor with Elastic Dome Structure
Teranishi, Tatsuki, Hirano, Hideki, Tanaka, ShujiYear:
2019
Language:
english
DOI:
10.1109/transducers.2019.8808705
File:
PDF, 1.85 MB
english, 2019