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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration
Pares, G., Jean-Philippe, Michel, Edouard, Deschaseaux, Pierre, Ferris, Ayssar, Serhan, Alexandre, GiryYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00198
File:
PDF, 938 KB
english, 2019