Ultra thin ICs and MEMS elements: techniques for wafer...

Microsystem Technologies 2003 / 01 Vol. 9; Iss. 3

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

M. Feil, C. Alder, G. Klink, M. König, C. Landesberger, S. Scherbaum, G. Schwinn, H. Spöhrle
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Volume:
9
Language:
english
Pages:
7
DOI:
10.1007/s00542-002-0223-5
Date:
January, 2003
File:
PDF, 307 KB
english, 2003
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