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Cost-effectiveness and environmental aspects of flip chip bumping for system integration
K. Schischke, H. Griese, J. Müller, H. ReichlVolume:
9
Language:
english
Pages:
7
DOI:
10.1007/s00542-002-0247-x
Date:
May, 2003
File:
PDF, 144 KB
english, 2003