Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks
S. Brida, S. Metivet, D. Petit, O. StojanovicVolume:
12
Language:
english
Pages:
4
DOI:
10.1007/s00542-005-0004-z
Date:
December, 2005
File:
PDF, 309 KB
english, 2005