Wafer level encapsulation of microsystems using glass frit...

Microsystem Technologies 2006 / 04 Vol. 12; Iss. 5

Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel, M. Wiemer, J. Frömel
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Volume:
12
Language:
english
Pages:
5
DOI:
10.1007/s00542-005-0036-4
Date:
April, 2006
File:
PDF, 428 KB
english, 2006
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