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Wafer direct bonding with ambient pressure plasma activation
Markus Gabriel, Brad Johnson, Ralf Suss, Manfred Reiche, Marko EichlerVolume:
12
Language:
english
Pages:
4
DOI:
10.1007/s00542-005-0044-4
Date:
April, 2006
File:
PDF, 309 KB
english, 2006