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A dielectrophoretic chip packaged at wafer level
Ciprian Iliescu, Francis E. H. Tay, Guolin Xu, Li Ming Yu, Victor SamperVolume:
12
Language:
english
Pages:
6
DOI:
10.1007/s00542-006-0126-y
Date:
September, 2006
File:
PDF, 470 KB
english, 2006