Evaluation of multi-Gbps serial link using wire-bonded...

Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe package

Nansen Chen, Hongchin Lin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
15
Language:
english
Pages:
8
DOI:
10.1007/s00542-008-0713-1
Date:
March, 2009
File:
PDF, 1.06 MB
english, 2009
Conversion to is in progress
Conversion to is failed