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Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe package
Nansen Chen, Hongchin LinVolume:
15
Language:
english
Pages:
8
DOI:
10.1007/s00542-008-0713-1
Date:
March, 2009
File:
PDF, 1.06 MB
english, 2009