Numerical analyses of peel demolding for UV embossing of...

Microsystem Technologies 2009 / 04 Vol. 15; Iss. 4

Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning

L. P. Yeo, S. C. Joshi, Y. C. Lam, Mary B. Chan-Park, D. E. Hardt
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Volume:
15
Language:
english
Pages:
13
DOI:
10.1007/s00542-008-0760-7
Date:
April, 2009
File:
PDF, 853 KB
english, 2009
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