Bonding of Cu-based high aspect ratio microscale structures...

Microsystem Technologies 2009 / 07 Vol. 15; Iss. 7

Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers

Fanghua Mei, Ke Chen, B. Lu, Wen Jin Meng
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Volume:
15
Language:
english
Pages:
8
DOI:
10.1007/s00542-009-0850-1
Date:
July, 2009
File:
PDF, 444 KB
english, 2009
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