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Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module
Kang-Wook Lee, Mitsumasa KoyanagiVolume:
16
Language:
english
Pages:
7
DOI:
10.1007/s00542-009-0941-z
Date:
March, 2010
File:
PDF, 786 KB
english, 2010