The thermal evaluation of the substrate mixed with...

Microsystem Technologies 2011 / 04 Vol. 17; Iss. 4

The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications

Wei-Tzuo Lin, De-Shau Huang, Ming-Tzer Lin, Chi-Ming Lai
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Volume:
17
Language:
english
Pages:
7
DOI:
10.1007/s00542-010-1154-1
Date:
April, 2011
File:
PDF, 536 KB
english, 2011
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