Development of a solder bump technique for contacting a...

Microsystem Technologies 1997 / 02 Vol. 3; Iss. 2

Development of a solder bump technique for contacting a three-dimensional multi electrode array

T. A. Frieswijk, J. A. Bielen, W. L. C. Rutten, P. Bergveld
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Volume:
3
Language:
english
Pages:
5
DOI:
10.1007/s005420050054
Date:
February, 1997
File:
PDF, 562 KB
english, 1997
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